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Dr. Bar-Cohen began his professional career at the Raytheon Company in Massachusetts in 1968 and since then has been involved in the design analysis and optimization of thermal systems with emphasis on the thermal packaging of electronic equipment. He has lectured widely published extensively in the archival heat transfer and packaging literature and taught many Short Courses on this subject both at universities and major conferences in the US and abroad. He is a Fellow of ASME and of IEEE and serves as the Editor of the IEEE Transactions on Components and Packaging Technologies. Today he serves as a Distinguished University Professor and Chair within the department of Mechanical Engineering for the University of Maryland.
Prof. Bar-Cohen served as General Manager and Executive Consultant for packaging and physical modeling at Control Data Corporation 1984-1989 held a succession of academic appointments from Lecturer to Professor in the Department of Mechanical Engineering at the Ben Gurion University of the Negev (Israel) 1973-1988 held the Sweatt Chair in Technological Leadership at the University of Minnesota where he also served as the Director of the Center for the Development of Technological Leadership from 1997 to 2002 and Professor of Mechanical Engineering from 1992 to 2002.
In the past he also held faculty positions at the Massachusetts Institute of Technology 1977-1978 and the Naval Postgraduate School 1982. In 1988 Prof. Bar-Cohen was the founding chairman of the ASME/IEEE Intersociety Conference on Thermal Phenomena in Electronic Systems (ITHERM) and chaired the 2nd ITHERM Conference in 1990. Among other responsibilities he served as the General Chairman for the first InterPack (International Intersociety Packaging Conference) in 1995; chaired the International Advisory Committee of the 1997 Electronic Packaging Technology Conference in Singapore and was Chairman of the International Conference on Heat Exchangers for Sustainable Development June 1998 in Lisbon Portugal and Co-Chair of New and Renewable Technologies for Sustainable Development July 2000 in Madeira Portugal. He has also participated in organizing numerous technical sessions at ASME's NHTC InterPack and IMECE (WAM) Conferences as well as at IEEE IEPS SPIE ITHERM Eurotherm ICHMT and other international Conferences and Workshops in Europe and Asia. In 1993 he was invited by the UN to lecture and consult to the electronics industry in India.
In 1998 he was elected to the Scientific Council of the International Center for Heat and Mass Transfer (ICHMT) headquartered in Turkey. Prof. Bar-Cohen currently serves on the Steering Committee of the ASME Nanotechnology Institute and is Chair of the US Scientific Committee of the International Heat Transfer Assembly (1998-2002). Prof. Bar-Cohen is co-author (with A.D. Kraus) of Design and Analysis of Heat Sinks (1995) and Thermal Analysis and Control of Electronic Equipment (1983) and has co-edited nine books in this field including the ASME Press Series Advances in Thermal Modeling of Electronic Components and Systems and the John Wiley & Sons Series in Thermal Management of Microelectronic and Electronic Systems. He has authored and co-authored some 75 Journal papers 115 Refereed Proceedings papers and 32 chapters in books and has delivered 40 keynote plenary and invited lectures at major technical Conferences and Institutions. | 