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Dr. Enck has had extensive experience in the measurement and development of electrical, electro-photographic, and thermal properties of advanced materials over the past 35 years. He has worked in the advanced packaging, medical, and electro-photographic industries. He has been a leader in the development of new measurement techniques that have addressed unsolved problems in these fields. Dr. Enck is currently Principal Scientist, Electrical and Thermal Analysis, of CMC Interconnect Technologies, where he is responsible for electrical, thermal, and optical analyses. This work has included dielectric breakdown measurements, low frequency and microwave frequency dielectric characterization of packaging materials and devices, and thermal conductivity and thermal resistance measurement of packaging materials, devices, and thermal interface materials. Prior to his involvement with CMC Interconnect Technologies, Dr. Enck held various positions in the advanced material and failure analysis industries. These included senior technical positions at Medtronic Failure Analysis Laboratory, Carborundum Microelectronics, BP America Research Laboratory, Xerox Research Laboratory, and IBM Research Laboratory. His focus in these positions has been development and characterization of new materials and devices, and development of new characterization techniques critical to material development. Dr. Enck earned his doctorate from Syracuse University in 1967 in Physics, with a focus on optical and transport properties of semiconductors. He continued his semiconductor studies as a Post-Doctoral Research Associate at Purdue University. | 